Note: The job is a remote job and is open to candidates in USA. Axelera AI is a pioneering deep-tech startup focused on creating next-generation AI platforms. They are seeking a Senior Advanced Packaging & Power Delivery Engineer to lead the design and architecture of power delivery systems for advanced AI accelerators, ensuring optimal performance and integration across silicon and packaging.

Responsibilities

• Own power-delivery design end to end, from on-die power grids to package and PCB PDN design and analysis
• Lead advanced packaging architecture decisions for 2.5D/3D stacking, multi-chiplet integration, and interposer/substrate co-design
• Perform SI/PI verification and sign-off across the full stack, ensuring power integrity and signal integrity targets are met
• Collaborate with the AIIS and Silicon Engineering teams to align power delivery and packaging solutions with product and silicon requirements
• Support thermal and integration reviews for current and future products
• Develop and maintain power-delivery methodology, flows, and design guidelines within the Custom Design toolchain
• Identify and mitigate single-point-of-failure risks in SI/PI workstreams; mentor and grow the team's packaging expertise
• Engage with external partners, substrate/interposer vendors, and OSAT houses to co-develop advanced packaging solutions

Skills

• Bachelor's or Master's degree in Electrical Engineering, Microelectronics, or a related field; PhD is a plus
• 7+ years of experience in power delivery and/or advanced packaging design in a semiconductor or deep-tech environment
• Demonstrated expertise in on-die power grid design and package/PCB PDN analysis
• Hands-on experience with 2.5D and/or 3D IC packaging technologies, multi-chiplet integration, and interposer/substrate co-design
• Proficiency with industry-standard EDA tools for power integrity, PDN simulation, and package design
• Ability to work cross-functionally and communicate complex technical trade-offs to diverse stakeholder groups
• Strong written and spoken English communication skills
• Experience with SI/PI verification and sign-off methodologies
• Familiarity with thermal modeling and co-simulation for integrated packages
• Exposure to AI accelerator or custom ASIC design flows
• Experience collaborating with OSAT partners, substrate vendors, or research institutes (e.g., imec)
• Knowledge of advanced node custom and analog design practices

Benefits

• Pension plan
• Extensive employee insurances
• Option to get company shares
• Flexible working arrangement
• Work from one of our Axelera AI offices (Leuven in Belgium, Amsterdam and Eindhoven in the Netherlands, Zurich in Switzerland, Florence and Milan in Italy or Bristol in the United Kingdom) if you're already based in the vicinity.
• Work fully remotely from any European country (incl. the UK) you are already in.
• Relocate with us and work from Italy (Florence or Milan) or the Netherlands (Amsterdam or Eindhoven).
• An open culture that supports creativity and continual innovation
• Collaborative ownership and freedom with responsibility

Company Overview