Note: The job is a remote job and is open to candidates in USA. Piper Companies is seeking a Senior Substrate Layout Designer who will be responsible for leading the design of advanced multi-die substrate packages. The layout designer will be involved in various design tasks and collaboration to ensure high-performance IC packaging.

Responsibilities

• Lead the end-to-end physical layout of high-density, multi-die substrate design
• Design and optimize bump maps, breakout routing, via structures, and layer stack-ups
• Collaborate with ASIC, signal integrity, and power teams to ensure clean escape routing and breakout strategies
• Evaluate routing feasibility in co-design environments, considering die floorplans and mechanical constraints
• Drive DRC, DFM, and manufacturing rule checks to ensure fabrication readiness
• Interface with substrate vendors and OSATs for tape-out and manufacturability validation
• Conduct technical reviews and iterate on layout improvements with internal and external stakeholders

Skills

• 6 - 8+ years of experience in substrate layout design for high-performance IC packaging
• Proven experience expertise in organic substrate design from silicon to BGA
• Deep understanding of chiplet-based, multi-die, and advanced packaging (FPGA, CPU, CPU, MCM, CoWoS)
• Strong collaboration skills with ASIC, signal, and power teams
• Proficiency in Cadence Allegro APD and AutoCAD
• Experience working with OSATs and substrate supplies
• Bachelor's degree in Electrical Engineering or equivalent experience

Benefits

• Comprehensive benefits: Medical, Dental, Vision, 401k, PTO, holidays, and sick leave as required by law.

Company Overview

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